LASER DISPLACEMENT DETECTION SERIES
Lamination Process
Screw Fastening/ Welding Process
Automated Optical Inspection
Non-Standard Process
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Equipment Features
1. Employs optical inspection methods such as laser, spectroscopy, and vision, ensuring non-contact, pressure-free, deformation-free, and scratch-free operation, perfectly adapting to fragile components such as thin sheets, flexible circuit boards, coated surfaces, and glass.
2. Micron-level measurement accuracy, high repeatability, unaffected by manual techniques or force, with data consistency far exceeding that of dial indicators and calipers.
3. Outputs multiple indicators such as thickness, thickness difference, flatness, warpage, and parallelism in a single scan, offering comprehensive functionality.
4. With no contact pins or probes, ensuring consistent accuracy over long-term use and extremely low maintenance costs.
5. Automatic alarm, recording, and sorting for out-of-tolerance checks, preventing defective products from leaving the site.
6. Automatically saves measurement data, waveforms, and images, supporting SPC analysis and report export, facilitating customer factory audits, quality traceability, and system audits.
Technical Specifications
| Item | Specifications |
| Equipment Model | MY-NTFM01 |
| Equipment Function | High-precision visual testing of product component TS |
| Applicable Dimensions | L:80mm~200mm x W:40mm~130mm |
| Correlation & Stability | ≥10% |
| Alignment Method | CCD Vision-Guided Positioning |
| Equipment Dimensions | L900 x W750 x H1700 |
| Power Supply | AC220V 50/60Hz |
| Air Source Requirement | 0.6MPa (6Kgf/cm²) |
| Equipment Capacity | ≤52S/PCS |
| Other Main Functions | Automatic barcode scanning, expandable for automated loading/unloading |
Structural Part Thickness & Flatness Inspection Equipment
Equipment Features
1. Employs optical inspection methods such as laser, spectroscopy, and vision, ensuring non-contact, pressure-free, deformation-free, and scratch-free operation, perfectly adapting to fragile components such as thin sheets, flexible circuit boards, coated surfaces, and glass.
2. Micron-level measurement accuracy, high repeatability, unaffected by manual techniques or force, with data consistency far exceeding that of dial indicators and calipers.
3. Measures flatness, warpage, parallelism, height difference, and deformation, providing comprehensive point analysis to eliminate missed local defects.
4. With no contact pins or probes, ensuring consistent accuracy over long-term use and extremely low maintenance costs.
5. Automatic alarm, recording, and sorting for out-of-tolerance checks, preventing defective products from leaving the factory.
6. Automatically saves measurement data, waveforms, and images, supporting SPC analysis and report export, facilitating customer factory audits, quality traceability, and system audits.
For 3C, new energy, automotive electronics, medical devices, aerospace enterprises, we provide exclusive customized solutions and
equipment based on their unique demands and specific problems.
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